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RENA Inline Texture Etching Machine
$330,000
Year 2008 but never used
General Info:
Complete NEW IN CRATES ( 7 crates)
Located in USA
NEVER USED IN PRODUCTION
Manufacturer: RENA
Year: 2008
Wafer production rate: approximately 1400 wafers 156mm x 156mm per hour
Material Processed: Poly Silicon Wafers (Multi Crystalline Silicon) |
Ref227384 |
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Process: Detergent washing, Etching and drying
Wafer Size processing capability: 125mm and/or 156mm Square
5 transport lanes for all wafer sizes. Operates from left to right in respect to the operator. Distance between roller 48mm. Transport speed between .5M/min to 1.5M/min.
Cartridge carriage through the process Other info: RENA Wet Process Type ICT. New in crates, 7 total crates packaged for export. Located in USA. Overall in-stalled dimensions including loading and unloading 7500mm x 1900mm x 2050mm and approximately 3500 KG |
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